A New Class of Memory for the AI Era” was published by researchers at Microsoft. Abstract “AI clusters today are one of the ...

Plus, check out the blogs featured in the latest Low Power-High Performance newsletter: Fraunhofer’s Andy Heinig explains how ...

How to find and prevent complex systems from freezing up.

Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form ...

A new technical paper titled “Modular Compilation for Quantum Chiplet Architectures” was published by researchers at ...

Researchers from the University of Utah and the University of California Irvine discovered a new type of spin-orbit torque ...

A new technical paper titled “Novel Trade-offs in 5 nm FinFET SRAM Arrays at Extremely Low Temperatures” was published by ...

This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.

A new technical paper titled “3D integration of pixel readout chips using Through-Silicon-Vias” was published by researchers ...

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.

A new technical paper titled “Liquid-infused nanostructured composite as a high-performance thermal interface material for effective cooling” was published by researchers at Carnegie Mellon University ...